electronic components
x-ray tomography can show the inner
structure of electronic components, thus performing non-destructive test for
the sealed sample is the biggest advantage of this equipment. for the third generation semiconductor device,
large scale integrated circuit, and quantum device, this technology is the best
choice. engineers in sanying precison have
abundant experience in quality evaluation of pcb/pcba and failure analysis. for
the special problem, we have ability to provide the targeted solutions for the
researchers.pcb: non-wetting, layering, open
and short circuit;pcba: non-wetting, solder joint
cracking, missing part, component failure, corrosion;pcb test and evaluation: 3d
morphology analysis, measurement of inner structure.
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